Solution provided
Supplier identity
General description

TAIPRO Engineering focuses its activities on innovative assembly (packaging) of existing sensors and microelectronic COTS (Components Off The Shelf) to perform customized solutions with new functionalities for industrial applications. TAIPRO Engineering offers high technology services in and around the fields of microelectronics, Microsystems, microassembly and packaging.

Type of Supplier
Service Provider - CMO / CRO
Region of Wallonia, BE
Regional access broker
  • Annick Pierrard, Interface Enterprises-University of Liège
Activity description
The 3 top equipments available

To develop its activities, TAIPRO Engineering has an access to MICROSYS’ facilities which include 12 specific equipments dedicated to versatile packaging operations (manual equipment with programmable parameters) located in a 200 m² certified clean room (ISO 7 – class 10000).

With these equipments, TAIPRO Engineering is able to assemble, interconnect, encapsulate and characterize a wide range of microsystems.

Capabilities of the facility:
• wafer sawing (till 8’’),
• plasma cleaning,
• pick and place (die attach, SMD and bare die pick & place, flip chip),
• ultrasonic wire bonding,
• tests (wire pull test, ball & die shear test, leak detector, electrical measurements),
• microsystems protection (potting, globe top, dam and fill, hermetic seam sealing),
• PCB gold plating,
• PCB machining,
• package decapsulation.

Know-how, expertise available

TAIPRO Engineering’s offer can be summarized in three main strategic axes:

- Full development project based on a functional and/or technical specification [a priori for industrial companies having no or few specific knowledge in the field of (micro)electronics]: feasibility studies – Proof of concept / prototype / demonstrator – small and ramp-up production series;
- Packaging design, support, prototyping and pre-production series for front-end and back-end sectors which need specific support before manufacturing: feasibility studies, support for packaging choices (wire bonds, die attach, solder paste, substrate, package…), demonstration and characterization, small and ramp-up (pre-production) production series;
- Training on specific packaging and testing equipments in an ISO7 accredited clean room.

Possibilities of partnership

Development of innovative sensor solutions.

Terms of availability for SMEs

TAIPRO participates to 2 european projects and 3 regional project . Each of them are to develop innovative sensors for a large range of different application (From space to pharmacy).

Training and Staff possibilities
Contact information
Managing Director
Phone number
+ 32 4 382 44 94
Email address
Website Address